publications Date of Publication Select Category 2024 (18) 2023 (14) 2022 (9) 2021 (10) 2020 (2) 2019 (2) 2018 (2) 2017 (5) 2016 (1) 2015 (8) 2014 (5) 2013 (6) 2012 (13) 2011 (11) 2010 (6) 2009 (3) 2008 (2) 2007 (4) 2006 (2) 2005 (1) PIFall: A Pressure Insole-Based Fall Detection System for the Elderly Using ResNet3D Wei Guo, Xiaoyang Liu, Chenghong Lu, and Lei Jing. (2024). Electronics 13, no. 6: 1066. Gait Analysis from Pressure Distributions for Patients with Becker Muscular Dystrophy Shunsuke Suzuki and Lei Jing. (2024). the 12th European Workshop on Visual Information Processing (EUVIP2024), Geneva, Switzerland, Sep., 2024 Recognizing Complex Activities by Combining Sequences of Basic Motions Chenghong Lu, Wu-Chun Hsu, and Lei Jing. (2024). Electronics 13, no. 2: 372. Human Activity Recognition via Wi-Fi and Inertial Sensors With Machine Learning Wei Guo, Shunsei Yamagishi and Lei Jing. (2024). in IEEE Access, vol. 12, pp. 18821-18836, 2024 Chest Compression Evaluation Based on Pose Estimation Yuki Lijima, Xin Zhu, Yumiko Kaneko, Lei Jing, Yan Pei, Ken Iseki. (2024). 28th International Conference on Circuits, Systems, Communications and Computers (CSCC2024), July, Greece. The Development of a Data Glove-Based System for Assisting the Solution of Puzzles Kazuma Sato and Lei Jing. (2024). IEEE CTSoc Conference on Gaming, Entertainment and Media (GEM2024), Italy, Jun, 2024 The Extended Kalman Filter with Improved Computation Time for Pedestrian Dead Reckoning Shunsei Yamagishi and Lei Jing. (2024). the 11th IEEE International Symposium on Inertial Sensors & Systems, Hiroshima, Japan, March, 2024 Calibration method of tactile sensors Lei Jing and Daisuke Miyata, Patent No. 2023-181739 「圧力センサ校正方法及び圧力センサ校正システム」（特願2023-181739） Data extension for Skeleton-based Sign Language Recognition using Adversarial Learning Yuriya Nakamura and Lei Jing. (2023) . the 15th Forum on Data Engineering and Information Management (DEIM2023), Gifu, Japan, March, 2023. (DBSJ Invited paper) The E-Textile Data Gloves for Peach Harvesting Daisuke Miyata, Zeping Yu, Daisuke Takata, Hiroshi Saito, and Lei Jing. (2023). the 4th Asian Horticultural Congress (AHC23), Tokyo, Japan, August, 2023 Previous 1234…12 Next
