publications

Light-weight Enhanced Semantics-Guided Neural Networks for Skeleton-Based Human Action Recognition

Hongbo Chen and Lei Jing. (2021) .
the 14th IEEE International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC21), Singapore, Dec., 2021

E-Textile-Based Tactile Sensor to Detect the Hand Strength Distribution for Preach Harvesting Training

Daisuke Miyada and Lei Jing. (2021).
the 23rd International Conference on Human-Computer Interaction (HCII21), Jul. 2021

Haptic Finger Glove for the VR Keyboard Input

Yuya Hoshi, Chenghong Lu, and Lei Jing. (2021).
the 23rd International Conference on Human-Computer Interaction (HCII21), Jul. 2021

Operation Efficiency Study on a New Cooperative VR Whiteboard System

Jiangkun Wang and Lei Jing. (2021).
the 23rd International Conference on Human-Computer Interaction (HCII21), Jul. 2021

Toothbrush Force Measurement and 3D Visualization

Kazuma Sakuma, Haicui Li, and Lei Jing. (2021).
the 23rd International Conference on Human-Computer Interaction (HCII21), Jul. 2021

Lightweight Long and Short-Range Spatial-Temporal GraphConvolutional Network for Skeleton-Based Action Recognition

HongboChen, MengleiLi, andLei Jing.(2021).
IEEE Access, Vol.9, pp.161374-161382

Lightweight Extended Kalman Filter for MARGSensors Attitude Estimation

Zeyang Dai and Lei Jing.(2021).
IEEE Sensors Journal, Vol.21, No.3, pp. 14749-14758

Time Drift Compensation Method on Multiple Wireless Motion Capture Nodes

Zeyang Dai, Chenghong Lu, and Lei Jing. (2020).
2020 13th International Conference on Human System Interaction (HSI20), Tokyo, Japan, 2020, pp. 266-271

Hand motion capture system based on multiple inertial sensors: demo abstract

Chenghong Lu, Jiangkun Wang, and Lei Jing. (2020).
In ACM Proceedings of the 18th Conference on Embedded Networked Sensor Systems (SenSys '20). New York, USA.

A Novel AR Whiteboard System and Usability Study

Jiangkun Wang, Tsubasa Endo, Chenghong Lu and Lei Jing. (2019)
2019 IEEE 8th Global Conference on Consumer Electronics (GCCE19), Osaka, Japan, 2019, pp. 28-30