admin Yuriya Nakamura and Lei Jing. (2023) .
the 15th Forum on Data Engineering and Information Management (DEIM2023), Gifu, Japan, March, 2023. (DBSJ Invited paper)
Daisuke Miyata, Zeping Yu, Daisuke Takata, Hiroshi Saito, and Lei Jing. (2023).
the 4th Asian Horticultural Congress (AHC23), Tokyo, Japan, August, 2023
Chenghong Lu, Yuriya Nakamura, Haru Nagamine, Lei Jing. (2023).
The 12th International Conference on Awareness Science and Technology (iCAST23), Taichung, Taiwan, Nov., 2023
Chenghong Lu, Misaki Kozakai, and Lei Jing.(2023).
Electronics12, no. 23: 4827.
Shunsei Yamagishi and Lei Jing.(2023).
in IEEE Sensors Letters, vol.7, no.12, pp.1-4, Dec.2023, Art no.6010404
Haicu Li and Lei Jing.(2023).
in IEEE Access, vol. 11, pp. 94753-94771
Chenghong Lu, Zeyang Dai and Lei Jing.(2023).
inIEEE Transactions on Instrumentation and Measurement, vol. 72, pp. 1-11, 2023, Art no. 9503211
Chenghong Lu, Shingo Amino, and Lei Jing.(2023).
Electronics12, no. 3: 613
I have been invited as a guest editor for the special issue on ‘Wearable Sensing Devices and Technologies’ in a SCI-E indexed journal on Electronics.
I delivered an invited lecture at NEDO on ‘P2P-Glove: Detection of Hand Force and Gesture Only with E-Textile Pressure Sensors’ (Video).
